Small Size Green Mask Electronic Control Board Two Sided PCB 3 OZ Copper Thickess
Number of layers: 2 layers
Material: FR4
Board thickness: 1.6mm
Surface plating: ENIG
Special process description: 1OZ
TG value: 180
Please call GSC if you need:
Fast turn-around prototypes.
Low-Medium-High volume production requirements.
To meet your prodution schedules.
On time delivery with a quality product.
A competitive price
PROTOTYPE AND VOLUME PRODUCTION:
Single sided
Double sided
Multilayer up to 8 layers
Immersion white tin process
About 1000 workers, 50000 ㎡ workshop, 13 years experience, 10 years' of exporting, ISO, TS & SGS certificated, 3 factories located in Shenzhen, Jiangxi and Jiangsu, this is how we keep superior quality and competitive offers for global valued customers.
Services and applications:
- Through hole board assembly
- SMT assembly including BGA assembly, smallest placement: 0201
- Material procurement
- Consigned material management
- Plastic or metal enclosure
- Complex final assembly
- Functional test
- Cable assembly
- Labeling and packing
- Customized logistics per customer
- Laser cut framed SMT solder paste stencils
- PCB design and schematic capture
PCBA capabilities:
- Component height: 0.2-25mm
- Min packing: 0201
- Min distance from
- BGA: 0.25-2.0mm
- Min BGA size: 0.1-0.63mm
- Min QFP space: 0.35mm
- Min assembly size: 50*30mm
- Max assembly size: 350*550mm
- Pick-placement precision: 0.01mm
- Pick-placement range: QFP, SOP, PLCC, BGA
- Placement capability: 0805, 0603, 0402, 0201
- High-pin count press fit available
- SMT capacity per day: 3,200,000 point
Competitive advantages:
- No minimum order quantity and free sample
- Focus on low to medium volume production
- Quick and on-time delivery
- International approvals
- Great customer service
- Diversified shipping method
| Materials |
Standard |
Advanced |
| FR4 (130‐180 Tg by DSC) |
Y |
Y |
| Halogen Free |
Y |
Y |
| BT Epoxy |
Y |
Y |
| Getek |
Y |
Y |
| Isola 370HR 406 408 IS410 IS 420 IS620 |
Y |
Y |
| Nelco 4000 |
Y |
Y |
| Rogers 4000 |
Y |
Y |
| PTFE |
Y |
Y |
| Dupont Pyralux |
N |
Y |
| Aluminum Core |
Y |
Y |
| Surface Finishes |
| ENIG |
Y |
Y |
| Flash Gold |
Y |
Y |
| Electrolytic Nickel/Hard Gold |
Y |
Y |
| HASL |
Y |
Y |
| Lead Free HASL |
Y |
Y |
| Immersion Ag |
Y |
Y |
| Standard Features |
Standard |
Advanced |
| Maximum layer count |
20 |
36 |
| Maximum Panel Size |
21″x24″ |
24″x30″ |
| Outer Layer Trace/Spacing (1/3 oz) |
0.0035″/0.0035″[90μm/90μm] |
0.0025″/0.003″[64μm/76μm] |
| Inner Layer Trace/Spacing (H oz) |
0.003″/0.003″ [76μm/76μm] |
0.002″/0.0025″ [50μm/64μm] |
| Maximum PCB thickness |
0.125″[3.2mm] |
0.177″[4.5mm] |
| Minimum PCB thickness |
0.008″[0.20mm] |
0.004″[0.10mm] |
| Minimum mechancial drill size |
0.008″[0.20mm] |
0.004″[0.10mm] |
| Maximum PCB aspect ration |
10:01 |
12:01 |
| Maximum copper weight |
5 oz [178μm] |
6 oz [214μm] |
| Minimum copper weight |
1/3 oz [12μm] |
1/4 oz [9μm] |
| Minimum core thickness |
0.002″[50μm] |
0.0015″[38μm] |
| Minimum dielectric thickness |
0.0025″[64μm] |
0.0015″[38μm] |
| Minimum Pad Size over Drill |
0.018″[0.46mm] |
0.016″[0.4mm] |
| Solder Mask Registration |
+/‐ 0.002″[50μm] |
+/‐ 0.0015″[38μm] |
| Mimimum Solder Mask Dam |
0.003″[76μm] |
0.0025″[64μm] |
| Copper feature to PCB edge |
0.015″[0.38mm] |
0.010″[0.25mm] |
| Tolerance on overall dimensions |
+/‐ 0.004″[100μm] |
+/‐ 0.002″[50μm] |
| HDI Features |
| Immersion Tin |
Y |
Y |
Product Tags:
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Small Size Green Mask Electronic Control Board Two Sided PCB 3 OZ Copper Thickess Images
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