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8 Layer Gold finger Multilayer PCB Board Fabrication , 94V 0 Circuit Board 1.6mm Thickness

Global Success Circuits Co.,Ltd
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8 Layer Gold finger Multilayer PCB Board Fabrication , 94V 0 Circuit Board 1.6mm Thickness

Brand Name : Global Success Circuits

Model Number : VNH-090

Certification : UL, ISO/TS16949 ISO/9001:2008 SGS

Place of Origin : China (mainland)

MOQ : 1 Piece

Payment Terms : L/C, T/T, Western Union

Delivery Time : 3 - 7 days

Packaging Details : Vacuum Packing with Carton Box

Material : FR4

Thickness : 1.6mm

Copper thickness : 2/1/1/1/1/1/1/2

solder mask : Green

silkscreen : White

surface finish : ENIG+gold finger

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8 Layer Gold finger Multilayer PCB Board Fabrication , 94V 0 Circuit Board 1.6mm Thickness

Quick Details

Place of Origin:Guangdong, China (Mainland)

Number of Layers:8-Layer

Base Material:FR4

Copper Thickness:2/1/1/1/1/1/1/2 oz

Board Thickness:1.6mm

Min. Hole Size:0.2mm

Min. Line Width:4mil

Min. Line Spacing:4mil

Surface Finishing:Immersion Gold+Gold Finger

Color:Green,Blue,Black,Red,Yellow,white

Finished board thickness:0.2-7.0mm

Finised copper thickness:1-6OZ

PCB Standard:IPC-A-610 D

Board thickness tolerance:+/-10%

Hole tolerance: PTH: +/-3mil NPTH: +/-2mil

Min distance pad-pad:8mil

Min distance trace-pad:8mil

Min distance trace-via:4mil

Manufacture Capacity

Type of Assembly THD (Thru-Hole Device), SMT (Surface-Mount Technology), SMT & THD mixed, Double-sided SMT and THD assembly
Solder Type Water Soluble Solder Paste, Leaded process and Lead-Free (RoHS)
Components

Passives parts, smallest size 0201

BGA, uBGA, QFN, POP, and Leadless chips

Fine Pitch to 0.8Mils;

BGA Repair and Reball; Part Removal and Replacement

Connectors and terminals

Bare Board Size

Smallest:0.25’’x 0.25’’ (6.35mm x 6.35mm)

Largest: 20’’ x 20’’ (508mm x 508mm)

Min. IC Pitch 0.012’’ (0.3mm)
QFN Lead Pitch 0.012’’ (0.3mm)
Max. BGA size 2.90’’ x 2.90’’ (74mm x 74mm)
Type of Service urn-key, partial turn-key or consignment
Testing

X-ray Inspection

AOI (Automated Optical Inspection)

ICT (In-Circuit Test)/Functional Testing

Component packaging Reels, cut tape, Tube and tray, Loose parts and bulk


Advantages:
▪ No MOQ, 13 years of PCB&PCBA turnkey services
▪ Quick turn, prototype, low & medium & high volume
▪ Components sourcing, OEM services provide
▪ ISO 9001-, ISO 14001-, ISO/TS16949, ISO 13485, IATF16949, OHSAS18001 certified, UL
▪ 100% E-test, visual, AOI inspection, including X-ray, 3D microscope and ICT
▪ Fast response within 24 hours

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer with a separated factory.

Q:What do I need to offer for production?
A: Basiclly PCB file and bom,if you have other requirement,just let us know?


Q: No PCB file and bom, only have the PCBA sample,can you produce PCBA for me?
A: Yes, we could help you to clone the PCBA . Just send the sample PCBA to us, we could clone the PCBA design and work out the PCB files and bom, then produce for you. The cloning cost is very low.

Q:What is your minimum order quantity?
A: No MOQ

Application

8 Layer Gold finger Multilayer PCB Board Fabrication , 94V 0 Circuit Board 1.6mm Thickness


Product Tags:

multilayer printed circuit board

      

multilayer pcb fabrication

      
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