2 Oz Green Mask Impedance Control PCB Manufacturing Service 1.6MM Thickness
Number of layers: 2 layers
Material: FR4
Board thickness: 1.6mm
Surface plating: ENIG
Special process description: 1OZ
TG value: 135
Who We Are
Established in 2005, Global Success is a professional manufacturer of PCB & PCBA and EMS (electronics manufacturing service) with nearly 15-year experience PCB Fabrication, PCB Assembly, PCBA Prototype, PCBA Test, Electronic Part Sourcing and EMS for kinds of smart electronic manufacturing.
PCBA Testing
We equipped a team of 3 skilled technical engineers who have many years experience in the field to put our strict testing flows and standards into practice. In the whole testing flow, by AOI, flying test and testing jig test we first test the flows of circuit board production including through-hole status, short circuit and appearance, etc. For some complicated craft flows e.g. in high precision or blind via boards, even only wafer analysis can discover testing problems.
Our PCBA test is a complete system which includes FCT, ICT, AOI and so on, so that we make sure each product out of our factory are consistent with the designed parameters and specifications. Before the PCB assembly, we always need to communicate with customers for the confirmation of a test plan. Usually our testing team will help our customers copy if they are pleased to hand over IC program, and then make FCT by testing jig which is usually customized according to PCB functions. (For full idea about FCT, ICT and AOI, you may know about them by Google.)
Please call GSC if you need:
Fast turn-around prototypes.
Low-Medium-High volume production requirements.
To meet your prodution schedules.
On time delivery with a quality product.
A competitive price
PROTOTYPE AND VOLUME PRODUCTION:
Single sided
Double sided
Multilayer up to 8 layers
Immersion white tin process
About 1000 workers, 50000 ㎡ workshop, 13 years experience, 10 years' of exporting, ISO, TS & SGS certificated, 3 factories located in Shenzhen, Jiangxi and Jiangsu, this is how we keep superior quality and competitive offers for global valued customers.
Services and applications:
- Through hole board assembly
- SMT assembly including BGA assembly, smallest placement: 0201
- Material procurement
- Consigned material management
- Plastic or metal enclosure
- Complex final assembly
- Functional test
- Cable assembly
- Labeling and packing
- Customized logistics per customer
- Laser cut framed SMT solder paste stencils
- PCB design and schematic capture
PCBA capabilities:
- Component height: 0.2-25mm
- Min packing: 0201
- Min distance from
- BGA: 0.25-2.0mm
- Min BGA size: 0.1-0.63mm
- Min QFP space: 0.35mm
- Min assembly size: 50*30mm
- Max assembly size: 350*550mm
- Pick-placement precision: 0.01mm
- Pick-placement range: QFP, SOP, PLCC, BGA
- Placement capability: 0805, 0603, 0402, 0201
- High-pin count press fit available
- SMT capacity per day: 3,200,000 point
Competitive advantages:
- No minimum order quantity and free sample
- Focus on low to medium volume production
- Quick and on-time delivery
- International approvals
- Great customer service
- Diversified shipping method
| Materials | Standard | Advanced |
| FR4 (130‐180 Tg by DSC) | Y | Y |
| Halogen Free | Y | Y |
| BT Epoxy | Y | Y |
| Getek | Y | Y |
| Isola 370HR 406 408 IS410 IS 420 IS620 | Y | Y |
| Nelco 4000 | Y | Y |
| Rogers 4000 | Y | Y |
| PTFE | Y | Y |
| Dupont Pyralux | N | Y |
| Aluminum Core | Y | Y |
| Surface Finishes |
| ENIG | Y | Y |
| Flash Gold | Y | Y |
| Electrolytic Nickel/Hard Gold | Y | Y |
| HASL | Y | Y |
| Lead Free HASL | Y | Y |
| Immersion Ag | Y | Y |
| Standard Features | Standard | Advanced |
| Maximum layer count | 20 | 36 |
| Maximum Panel Size | 21″x24″ | 24″x30″ |
| Outer Layer Trace/Spacing (1/3 oz) | 0.0035″/0.0035″[90μm/90μm] | 0.0025″/0.003″[64μm/76μm] |
| Inner Layer Trace/Spacing (H oz) | 0.003″/0.003″ [76μm/76μm] | 0.002″/0.0025″ [50μm/64μm] |
| Maximum PCB thickness | 0.125″[3.2mm] | 0.177″[4.5mm] |
| Minimum PCB thickness | 0.008″[0.20mm] | 0.004″[0.10mm] |
| Minimum mechancial drill size | 0.008″[0.20mm] | 0.004″[0.10mm] |
| Maximum PCB aspect ration | 10:01 | 12:01 |
| Maximum copper weight | 5 oz [178μm] | 6 oz [214μm] |
| Minimum copper weight | 1/3 oz [12μm] | 1/4 oz [9μm] |
| Minimum core thickness | 0.002″[50μm] | 0.0015″[38μm] |
| Minimum dielectric thickness | 0.0025″[64μm] | 0.0015″[38μm] |
| Minimum Pad Size over Drill | 0.018″[0.46mm] | 0.016″[0.4mm] |
| Solder Mask Registration | +/‐ 0.002″[50μm] | +/‐ 0.0015″[38μm] |
| Mimimum Solder Mask Dam | 0.003″[76μm] | 0.0025″[64μm] |
| Copper feature to PCB edge | 0.015″[0.38mm] | 0.010″[0.25mm] |
| Tolerance on overall dimensions | +/‐ 0.004″[100μm] | +/‐ 0.002″[50μm] |
| HDI Features |
| Immersion Tin | Y | Y |
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2 Oz Green Mask Impedance Control PCB Manufacturing Service 1.6MM Thickness Images
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